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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE9216-A Issued Date : 1998.07.01 Revised Date : 1999.08.01 Page No. : 1/3 HTIF127 PNP EPITAXIAL PLANAR TRANSISTOR Description The HTIF127 is designed for use in general purpose amplifier and low-speed switching applications. Absolute Maximum Ratings (Ta=25C) * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) .................................................................................... 45 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage ................................................................................... -100 V BVCEO Collector to Emitter Voltage................................................................................ -100 V BVEBO Emitter to Base Voltage .......................................................................................... -5 V IC Collector Current (Pulse)................................................................................................. -8 A IC Collector Current (Continuous)........................................................................................ -5 A IB Base Current ............................................................................................................ -120 mA Characteristics (Ta=25C) Symbol BVCBO *BVCEO ICBO ICEO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(on) *hFE1 *hFE2 Min. -100 -100 1 1 Typ. Max. -200 -500 -2 -2 -4 -2.5 Unit V V uA uA mA V V V K K Test Conditions IC=-1mA IC=-100mA VCB=-100V VCE=-50V VEB=-5V IC=-3A, IB=-12mA IC=-5A, IB=-20mA IC=-3A, VCE=-3V IC=-0.5A, VCE=-3V IC=-3A, VCE=-3V *Pulse Test : Pulse Width 380us, Duty Cycle2% HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 10000 10000 Spec. No. : HE9216-A Issued Date : 1998.07.01 Revised Date : 1999.08.01 Page No. : 2/3 Saturation Voltage & Collector Current Saturation Voltage (mV) 1000 hFE @ VCE=4V hFE 100 1000 VBE(sat) @ IC=100IB VCE(sat) @ IC=100IB 10 1 1 10 100 1000 10000 100 10 100 1000 10000 Collector Current (mA) Collector Current (mA) On Voltage & Collector Current 10000 10 Switching Time & Collector Current VCC=30V, IC=250IB1=-250IB2 Switching Times (us) On Voltage (mV) Tstg 1 Tf Ton 1000 VBE(on) @ VCE=4V 100 1 10 100 1000 10000 0.1 1 10 Collector Current (mA) Collector Current (A) Capacitance & Reverse-Biased Voltage 1000 100000 Safe Operating Area PT=1ms 10000 Collector Current-IC (mA) PT=100ms 1000 PT=1s 100 Capacitance (pF) 100 Cob 10 10 0.1 1 10 100 1 1 10 100 Reverse-Biased Voltage (V) Forward Voltage-VCE (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-220FP Dimension A B Spec. No. : HE9216-A Issued Date : 1998.07.01 Revised Date : 1999.08.01 Page No. : 3/3 Marking : 4 EO C HSMC Logo Part Number Date Code Product Series Rank 1 D 2 3 5 G H 3 I N Style : Pin 1.Base 2.Collector 3.Emitter J F 2 K 1 M L 3-Lead TO-220FP Plastic Package HSMC Package Code : F *:Typical DIM A B C D E F G H I J Inches Min. 0.2480 0.3386 0.1673 0.1043 0.0230 0.3980 0.1083 0.3386 Max. 0.2520 0.3425 0.1870 0.1083 0.0242 0.4039 0.1122 0.3425 *0.1496 *0.0236 Millimeters Min. Max. 6.30 6.40 8.60 8.70 4.25 4.75 2.65 2.75 0.58 0.61 10.11 10.26 2.75 2.85 8.60 8.70 *3.80 *0.60 DIM K L M N O 1 2 3 4 5 Inches Min. 0.5118 0.5886 0.1098 Max. *0.1004 0.5906 0.5925 *0.0669 0.1114 -2 *5 *15 *5 *5 Millimeters Min. Max. *2.55 13.00 15.00 14.95 15.05 *1.70 2.79 2.83 *2 *5 *15 *5 *5 Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification |
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